封装板是连接芯片与主板之间的桥梁，对芯片起到支撑和保护作用，

其特征在于高密度线路设计、成品的高精度及轻薄化；

作为高精密原件-芯片的载体，

其对于板材的孔粗品质和孔位精度有着极高的要求。

The packaging substrate serves as a bridge between the chip and the main board.

providing support and protection for the chip.

Its features lie in high-density circuit design,high precision of finished products and thinness and lightness.

As the carrier of high-precision components - chips

It has extremely high requirements for the hole diameter quality and hole position accuracy of the sheet material.

获取详细内容，请联系我们

For detailed information, please contact us

获取详细内容，请联系我们

For detailed information, please contact us

获取详细内容，请联系我们

For detailed information, please contact us

获取详细内容，请联系我们

For detailed information, please contact us