高频板作为针对射频、微波、毫米波等对信号高完整性要求的场景专门设计的特种PCB，

对材料的电气性能要求极为严格。

作为高频板主要材料的PTFE材料，同时具备超低介电常数、损耗因子，轻量化，低吸湿等优良的特性；

但PTFE在拥有极高的电气性能的同时，却因为对温度较为敏感，易变形的特征，

使得其加工过程中极易产生钻污黏在钻头和板的孔壁，造成钻孔铜瘤的问题，

除此之外，PTFE混压板的层压结构中同时包含了硬板和PTFE，这就使得钻头同时需要极高的锋利性能，

还能保证耐磨性能，因此成为了困扰诸多厂商的钻孔难题。

High-frequency boards, as special PCBs specifically designed for scenarios with highrequirements for signal integrity such as radio frequency.

microwave, and millimeter wave,

The electrical performance requirements for materials are extremely strict.

PTFE material, as the main material of high-frequency boards,

simultaneously possesses excellent properties such as ultra-low dielectric constant,(oss factor,lightweight, and low moisture absorption.

However, while PTFE has extremely high electrical properties,it is sensitive to temperature and prone to deformation.

This makes it very easy for drill dirt to stick to the drill bit and the hole wall of the plate during its processing,

causing the problem of copper burrs in the boreholes.

In addition, the laminated structure of the PTFE mixed pressure plate simultaneously contains both hard plates and PTFE,

which makes the drill bit require extremely high sharpness performance at the same time.

It can also ensure wear resistance,

thus becoming a drilling problem that troubles many manufacturers.rds need to be taken into account simultaneously,

and the processing plan should be comprehensively considered.

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